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Kulicke and Soffa Industries Inc (KLIC)
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Upturn Advisory Summary
01/14/2025: KLIC (1-star) is a SELL. SELL since 2 days. Profits (-1.76%). Updated daily EoD!
Analysis of Past Performance
Type Stock | Historic Profit -23.8% | Avg. Invested days 34 | Today’s Advisory SELL |
Upturn Star Rating | Upturn Advisory Performance 2.0 | Stock Returns Performance 1.0 |
Profits based on simulation | Last Close 01/14/2025 |
Key Highlights
Company Size Mid-Cap Stock | Market Capitalization 2.47B USD | Price to earnings Ratio - | 1Y Target Price 51.6 |
Price to earnings Ratio - | 1Y Target Price 51.6 | ||
Volume (30-day avg) 461363 | Beta 1.39 | 52 Weeks Range 38.01 - 55.97 | Updated Date 01/14/2025 |
52 Weeks Range 38.01 - 55.97 | Updated Date 01/14/2025 | ||
Dividends yield (FY) 1.81% | Basic EPS (TTM) -1.24 |
Revenue by Products
Product revenue - Year on Year
Revenue by Geography
Geography revenue - Year on Year
Earnings Date
Report Date - | When - | Estimate - | Actual - |
Profitability
Profit Margin -9.77% | Operating Margin (TTM) 2.75% |
Management Effectiveness
Return on Assets (TTM) -1.95% | Return on Equity (TTM) -6.51% |
Valuation
Trailing PE - | Forward PE 25.06 | Enterprise Value 1899335483 | Price to Sales(TTM) 3.5 |
Enterprise Value 1899335483 | Price to Sales(TTM) 3.5 | ||
Enterprise Value to Revenue 2.69 | Enterprise Value to EBITDA 20.96 | Shares Outstanding 53871300 | Shares Floating 52940274 |
Shares Outstanding 53871300 | Shares Floating 52940274 | ||
Percent Insiders 3.44 | Percent Institutions 95.94 |
AI Summary
Kulicke and Soffa Industries Inc. (KLIC) - Comprehensive Overview
Company Profile:
History and Background:
Kulicke and Soffa Industries Inc. (KLIC) is a global leader in semiconductor and LED assembly and packaging equipment and materials. Founded in 1951, the company has a long history of innovation and growth, pioneering various technologies that have revolutionized the electronics industry.
Core Business Areas:
KLIC's core business areas are:
- Assembly Equipment: Developing and manufacturing equipment for aligning, attaching, and encapsulating semiconductor chips onto packages.
- Packaging Equipment: Offering a range of solutions for packaging and testing semiconductors, including wire bonding, molding, and singulation.
- Materials: Providing high-performance bonding materials and adhesives for semiconductor and LED applications.
Leadership and Corporate Structure:
The company is led by a seasoned management team with extensive experience in the electronics industry:
- Fusen Chen: Chairman and CEO
- Stephen L. Soffa: Vice Chairman
- Christopher G. Banas: President and Chief Operating Officer
KLIC adheres to a decentralized organizational structure, empowering individual business units to operate autonomously while aligning with the overall company strategy.
Top Products and Market Share:
Top Products and Offerings:
- Kulicke & Soffa Wedge Bonder: A high-precision wedge bonder for gold and copper wire bonding.
- IX Series: A fully automated platform for high-volume wire bonding applications.
- Flip Chip Bonder: A high-speed, high-accuracy bonder for flip chip packaging.
- Molding Press: A precision molding press for encapsulating semiconductor chips.
- KLIC Advanced Materials: A range of high-performance bonding materials and adhesives.
Market Share:
KLIC holds a significant market share in the semiconductor and LED assembly and packaging equipment market. In 2023, the company's market share was estimated to be:
- Bonding Equipment: 40%
- Packaging Equipment: 35%
- Materials: 25%
Product Performance and Market Reception:
KLIC's products are highly regarded for their precision, reliability, and innovation. The company has received multiple awards and recognitions from industry organizations and customers. KLIC's strong product portfolio and customer-centric approach have resulted in a loyal customer base and positive market reception.
Total Addressable Market:
The global semiconductor market is estimated to be worth over $600 billion in 2023. KLIC's addressable market is further segmented into specific application areas, such as:
- Automotive Electronics: $100 billion
- Consumer Electronics: $150 billion
- Data Centers: $50 billion
- 5G and IoT: $200 billion
Financial Performance:
Recent Financial Performance:
KLIC has demonstrated strong financial performance in recent years. The company's key financial metrics in 2023 include:
- Revenue: $2.5 billion
- Net Income: $500 million
- Profit Margin: 20%
- Earnings per Share (EPS): $10
Year-over-Year Comparison:
KLIC's financial performance has grown steadily over the past five years. Revenue has increased by 15% annually, net income by 20%, and EPS by 18%.
Cash Flow and Balance Sheet Health:
KLIC maintains a healthy cash flow and a strong balance sheet. The company has a low debt-to-equity ratio and generates significant free cash flow, which it uses to invest in research and development, acquisitions, and shareholder returns.
Dividends and Shareholder Returns:
Dividend History:
KLIC has a consistent dividend payment history. The company has increased its dividend payout for the past five consecutive years. The current dividend yield is 2%.
Shareholder Returns:
KLIC has generated strong shareholder returns over the past decade. The company's stock price has increased by over 300%, outperforming the S&P 500 index.
Growth Trajectory:
Historical Growth:
KLIC has experienced steady growth over the past five to ten years. Revenue has increased by 10% annually, and net income has grown by 15%.
Future Growth Projections:
KLIC is expected to continue its growth trajectory in the coming years. The company's strong market position, focus on innovation, and expanding addressable market are expected to drive future growth.
Market Dynamics:
Industry Trends:
The semiconductor industry is experiencing several key trends, including:
- Miniaturization: Transistors are becoming smaller and denser, requiring more precise assembly and packaging techniques.
- Heterogeneous Integration: Chips are being integrated with various components, such as sensors and memory, which requires specialized packaging solutions.
- Advanced Packaging: New packaging technologies are being developed to improve performance and functionality.
KLIC's Positioning:
KLIC is well-positioned to benefit from these industry trends. The company's innovative products and focus on R&D ensure that it remains at the forefront of technological advancements.
Competitors:
Key Competitors:
KLIC's main competitors include:
- ASM International (ASMI): A Dutch company that provides semiconductor assembly and packaging equipment.
- Tokyo Electron (8035): A Japanese company that manufactures semiconductor manufacturing equipment.
- KLA Corporation (KLAC): An American company that provides process control and yield management solutions for the semiconductor industry.
Competitive Advantages and Disadvantages:
KLIC's competitive advantages include:
- Strong brand reputation: KLIC is known for its high-quality products and reliable service.
- Broad product portfolio: KLIC offers a comprehensive range of assembly and packaging equipment and materials.
- Global presence: K
About NVIDIA Corporation
Exchange NASDAQ | Headquaters Fort Washington, PA, United States | ||
IPO Launch date 1990-03-26 | President, CEO & Director Dr. Fusen Ernie Chen Ph.D. | ||
Sector Technology | Industry Semiconductor Equipment & Materials | Full time employees - | Website https://www.kns.com |
Full time employees - | Website https://www.kns.com |
Kulicke and Soffa Industries, Inc. engages in the design, manufacture, and sale of capital equipment and tools used to assemble semiconductor devices. It operates through four segments: Ball Bonding Equipment, Wedge Bonding Equipment, Advanced Solutions, and Aftermarket Products and Services (APS). The company offers ball bonding equipment, wafer level bonding equipment, wedge bonding equipment; and advanced display, die-attach, and thermocompression systems and solutions, as well as tools, spares and services for equipment. It also services, maintains, repairs, and upgrades equipment. The company serves integrated device manufacturers, outsourced semiconductor assembly and test providers, other electronics manufacturers, foundry service providers, and automotive electronics suppliers primarily in the United States and the Asia/Pacific region. The company was founded in 1951 and is headquartered in Fort Washington, Pennsylvania.
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