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Kulicke and Soffa Industries Inc (KLIC)



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Upturn Advisory Summary
04/01/2025: KLIC (1-star) is currently NOT-A-BUY. Pass it for now.
Analysis of Past Performance
Type Stock | Historic Profit -23.44% | Avg. Invested days 34 | Today’s Advisory PASS |
Upturn Star Rating ![]() ![]() | Upturn Advisory Performance ![]() | Stock Returns Performance ![]() |
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Key Highlights
Company Size Small-Cap Stock | Market Capitalization 1.81B USD | Price to earnings Ratio 307.91 | 1Y Target Price 51 |
Price to earnings Ratio 307.91 | 1Y Target Price 51 | ||
Volume (30-day avg) 627866 | Beta 1.39 | 52 Weeks Range 31.77 - 52.92 | Updated Date 04/2/2025 |
52 Weeks Range 31.77 - 52.92 | Updated Date 04/2/2025 | ||
Dividends yield (FY) 2.45% | Basic EPS (TTM) 0.11 |
Analyzing Revenue: Products, Geography and Growth
Revenue by Products
Product revenue - Year on Year
Revenue by Geography
Geography revenue - Year on Year
Earnings Date
Report Date 2025-03-13 | When Before Market | Estimate 0.28 | Actual 0.37 |
Profitability
Profit Margin 0.48% | Operating Margin (TTM) 6.42% |
Management Effectiveness
Return on Assets (TTM) 1.2% | Return on Equity (TTM) 0.31% |
Valuation
Trailing PE 307.91 | Forward PE 25.06 | Enterprise Value 1287585128 | Price to Sales(TTM) 2.58 |
Enterprise Value 1287585128 | Price to Sales(TTM) 2.58 | ||
Enterprise Value to Revenue 1.84 | Enterprise Value to EBITDA 28.67 | Shares Outstanding 53383200 | Shares Floating 51529704 |
Shares Outstanding 53383200 | Shares Floating 51529704 | ||
Percent Insiders 3.4 | Percent Institutions 96.23 |
Analyst Ratings
Rating 4 | Target Price 52 | Buy 1 | Strong Buy 2 |
Buy 1 | Strong Buy 2 | ||
Hold 2 | Sell - | Strong Sell - | |
Strong Sell - |
Upturn AI SWOT
Kulicke and Soffa Industries Inc

Company Overview
History and Background
Founded in 1951, Kulicke & Soffa Industries, Inc. (K&S) initially focused on manufacturing equipment for the semiconductor industry. Over time, it evolved into a leading provider of advanced packaging and electronic assembly solutions.
Core Business Areas
- Advanced Packaging: Offers solutions for advanced packaging including thermocompression bonding, flip chip, and fan-out wafer-level packaging.
- Electronic Assembly: Provides equipment for various electronic assembly processes, including wire bonding, die bonding, and wedge bonding.
Leadership and Structure
The leadership team includes key executives such as the CEO, CFO, and heads of various business units. The organizational structure is departmentalized with functional areas like R&D, sales, and operations.
Top Products and Market Share
Key Offerings
- Wire Bonders: K&S is a leading provider of wire bonding equipment used to connect microchips to external leads. Market share fluctuates, but is estimated between 40-50%. Competitors include ASM Pacific Technology and Panasonic.
- Advanced Packaging Solutions: Offers advanced packaging equipment for flip chip and other technologies. Market share is growing. Competitors include Besi, ASM Pacific Technology.
Market Dynamics
Industry Overview
The semiconductor equipment industry is cyclical and driven by demand for electronics and technological advancements. Increased adoption of advanced packaging technologies is a key trend.
Positioning
K&S holds a strong position in the wire bonding market and is expanding its presence in advanced packaging. Its competitive advantages include its technology and global customer base.
Total Addressable Market (TAM)
The total addressable market for semiconductor assembly and packaging equipment is estimated at several billion dollars. K&S is positioned to capture a significant portion of this TAM, particularly with its expansion into advanced packaging.
Upturn SWOT Analysis
Strengths
- Strong brand recognition in wire bonding
- Established global customer base
- Technology leadership in certain areas
- Experienced management team
Weaknesses
- Dependence on cyclical semiconductor industry
- Exposure to economic downturns
- Competition from larger, more diversified companies
Opportunities
- Growth in advanced packaging
- Expansion into new markets
- Increased demand for automotive electronics
- Adoption of 5G and AI technologies
Threats
- Intense competition
- Technological obsolescence
- Geopolitical risks
- Fluctuations in currency exchange rates
Competitors and Market Share
Key Competitors
- ASM Pacific Technology (0522.HK)
- Besi (BESI.AS)
- Toray (3402.T)
Competitive Landscape
K&S is a key player in wire bonding and advanced packaging. Its advantages include technology and customer relationships. Its disadvantages are smaller size compared to more diversified players.
Major Acquisitions
Liteq
- Year: 2020
- Acquisition Price (USD millions): 94.4
- Strategic Rationale: Strengthen K&S's advanced packaging solutions and expand its lithography capabilities.
Growth Trajectory and Initiatives
Historical Growth: K&S's growth has been cyclical, influenced by the semiconductor industry. Expansion into advanced packaging has driven recent growth.
Future Projections: Analyst estimates vary, but generally project continued growth in advanced packaging and moderate growth in core wire bonding business.
Recent Initiatives: Recent initiatives include investments in R&D for advanced packaging technologies and strategic acquisitions.
Summary
Kulicke & Soffa is a leading semiconductor equipment company with strengths in wire bonding and growing presence in advanced packaging. Its cyclical nature of the industry and competition are its main weaknesses. Growth opportunities exist within automotive electronics and 5G. The expansion of advanced packaging technologies will determine the future of the company.
Similar Companies
Sources and Disclaimers
Data Sources:
- Company filings
- Industry reports
- Analyst estimates
- Market research reports
Disclaimers:
This analysis is for informational purposes only and does not constitute investment advice. Financial data is subject to change. Market share estimates are approximate.
AI Summarization is directionally correct and might not be accurate.
Summarized information shown could be a few years old and not current.
Fundamental Rating based on AI could be based on old data.
AI-generated summaries may have inaccuracies (hallucinations). Please verify the information before taking action.
About Kulicke and Soffa Industries Inc
Exchange NASDAQ | Headquaters Fort Washington, PA, United States | ||
IPO Launch date 1990-03-26 | President, CEO & Director Dr. Fusen Ernie Chen Ph.D. | ||
Sector Technology | Industry Semiconductor Equipment & Materials | Full time employees 2702 | Website https://www.kns.com |
Full time employees 2702 | Website https://www.kns.com |
Kulicke and Soffa Industries, Inc. engages in the design, manufacture, and sale of capital equipment and tools used to assemble semiconductor devices. It operates through four segments: Ball Bonding Equipment, Wedge Bonding Equipment, Advanced Solutions, and Aftermarket Products and Services (APS). The company offers ball bonding equipment, wafer level bonding equipment, wedge bonding equipment; and advanced display, die-attach, and thermocompression systems and solutions, as well as tools, spares and services for equipment. It also services, maintains, repairs, and upgrades equipment. The company serves integrated device manufacturers, outsourced semiconductor assembly and test providers, other electronics manufacturers, foundry service providers, and automotive electronics suppliers primarily in the United States and the Asia/Pacific region. The company was founded in 1951 and is headquartered in Fort Washington, Pennsylvania.
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