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Upturn stock ratingUpturn stock rating
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Kulicke and Soffa Industries Inc (KLIC)

Upturn stock ratingUpturn stock rating
$33.5
Delayed price
upturn advisory
PASS
  • BUY Advisory
  • SELL Advisory (Profit)​
  • SELL Advisory (Loss)​
  • Profit
  • Loss
  • Pass (Skip investing)
Upturn Stock infoUpturn Stock info Stock price based on last close
*as per simulation
(see disclosures)
Time period over
  • ALL
  • YEAR
  • MONTH
  • WEEK

Upturn Advisory Summary

04/01/2025: KLIC (1-star) is currently NOT-A-BUY. Pass it for now.

Upturn Star Rating

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Not Recommended Performance

These Stocks/ETFs, based on Upturn Advisory, consistently fall short of market performance, signaling caution before investing.

AI Based Fundamental Rating

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Below Average Performance

These Stocks/ETFs, based on Upturn Advisory, often underperform the market, warranting careful consideration before investing.

Analysis of Past Performance

Type Stock
Historic Profit -23.44%
Avg. Invested days 34
Today’s Advisory PASS
Upturn Star Rating Upturn stock ratingUpturn stock rating
Upturn Advisory Performance Upturn Advisory Performance 2.0
Stock Returns Performance Upturn Returns Performance 1.0
Upturn Profits based on simulationUpturn Profits based on simulation Profits based on simulation
Upturn Profits based on simulationUpturn Profits based on simulation Last Close 04/01/2025

Key Highlights

Company Size Small-Cap Stock
Market Capitalization 1.81B USD
Price to earnings Ratio 307.91
1Y Target Price 51
Price to earnings Ratio 307.91
1Y Target Price 51
Volume (30-day avg) 627866
Beta 1.39
52 Weeks Range 31.77 - 52.92
Updated Date 04/2/2025
52 Weeks Range 31.77 - 52.92
Updated Date 04/2/2025
Dividends yield (FY) 2.45%
Basic EPS (TTM) 0.11

Analyzing Revenue: Products, Geography and Growth

Revenue by Products

Product revenue - Year on Year

Revenue by Geography

Geography revenue - Year on Year

Earnings Date

Report Date 2025-03-13
When Before Market
Estimate 0.28
Actual 0.37

Profitability

Profit Margin 0.48%
Operating Margin (TTM) 6.42%

Management Effectiveness

Return on Assets (TTM) 1.2%
Return on Equity (TTM) 0.31%

Valuation

Trailing PE 307.91
Forward PE 25.06
Enterprise Value 1287585128
Price to Sales(TTM) 2.58
Enterprise Value 1287585128
Price to Sales(TTM) 2.58
Enterprise Value to Revenue 1.84
Enterprise Value to EBITDA 28.67
Shares Outstanding 53383200
Shares Floating 51529704
Shares Outstanding 53383200
Shares Floating 51529704
Percent Insiders 3.4
Percent Institutions 96.23

Analyst Ratings

Rating 4
Target Price 52
Buy 1
Strong Buy 2
Buy 1
Strong Buy 2
Hold 2
Sell -
Strong Sell -
Strong Sell -

ai summary icon Upturn AI SWOT

Kulicke and Soffa Industries Inc

stock logo

Company Overview

overview logo History and Background

Founded in 1951, Kulicke & Soffa Industries, Inc. (K&S) initially focused on manufacturing equipment for the semiconductor industry. Over time, it evolved into a leading provider of advanced packaging and electronic assembly solutions.

business area logo Core Business Areas

  • Advanced Packaging: Offers solutions for advanced packaging including thermocompression bonding, flip chip, and fan-out wafer-level packaging.
  • Electronic Assembly: Provides equipment for various electronic assembly processes, including wire bonding, die bonding, and wedge bonding.

leadership logo Leadership and Structure

The leadership team includes key executives such as the CEO, CFO, and heads of various business units. The organizational structure is departmentalized with functional areas like R&D, sales, and operations.

Top Products and Market Share

overview logo Key Offerings

  • Wire Bonders: K&S is a leading provider of wire bonding equipment used to connect microchips to external leads. Market share fluctuates, but is estimated between 40-50%. Competitors include ASM Pacific Technology and Panasonic.
  • Advanced Packaging Solutions: Offers advanced packaging equipment for flip chip and other technologies. Market share is growing. Competitors include Besi, ASM Pacific Technology.

Market Dynamics

industry overview logo Industry Overview

The semiconductor equipment industry is cyclical and driven by demand for electronics and technological advancements. Increased adoption of advanced packaging technologies is a key trend.

Positioning

K&S holds a strong position in the wire bonding market and is expanding its presence in advanced packaging. Its competitive advantages include its technology and global customer base.

Total Addressable Market (TAM)

The total addressable market for semiconductor assembly and packaging equipment is estimated at several billion dollars. K&S is positioned to capture a significant portion of this TAM, particularly with its expansion into advanced packaging.

Upturn SWOT Analysis

Strengths

  • Strong brand recognition in wire bonding
  • Established global customer base
  • Technology leadership in certain areas
  • Experienced management team

Weaknesses

  • Dependence on cyclical semiconductor industry
  • Exposure to economic downturns
  • Competition from larger, more diversified companies

Opportunities

  • Growth in advanced packaging
  • Expansion into new markets
  • Increased demand for automotive electronics
  • Adoption of 5G and AI technologies

Threats

  • Intense competition
  • Technological obsolescence
  • Geopolitical risks
  • Fluctuations in currency exchange rates

Competitors and Market Share

competitor logo Key Competitors

  • ASM Pacific Technology (0522.HK)
  • Besi (BESI.AS)
  • Toray (3402.T)

Competitive Landscape

K&S is a key player in wire bonding and advanced packaging. Its advantages include technology and customer relationships. Its disadvantages are smaller size compared to more diversified players.

Major Acquisitions

Liteq

  • Year: 2020
  • Acquisition Price (USD millions): 94.4
  • Strategic Rationale: Strengthen K&S's advanced packaging solutions and expand its lithography capabilities.

Growth Trajectory and Initiatives

Historical Growth: K&S's growth has been cyclical, influenced by the semiconductor industry. Expansion into advanced packaging has driven recent growth.

Future Projections: Analyst estimates vary, but generally project continued growth in advanced packaging and moderate growth in core wire bonding business.

Recent Initiatives: Recent initiatives include investments in R&D for advanced packaging technologies and strategic acquisitions.

Summary

Kulicke & Soffa is a leading semiconductor equipment company with strengths in wire bonding and growing presence in advanced packaging. Its cyclical nature of the industry and competition are its main weaknesses. Growth opportunities exist within automotive electronics and 5G. The expansion of advanced packaging technologies will determine the future of the company.

Similar Companies

Sources and Disclaimers

Data Sources:

  • Company filings
  • Industry reports
  • Analyst estimates
  • Market research reports

Disclaimers:

This analysis is for informational purposes only and does not constitute investment advice. Financial data is subject to change. Market share estimates are approximate.

Upturn AI SummarizationUpturn AI Summarization AI Summarization is directionally correct and might not be accurate.

Upturn AI SummarizationUpturn AI Summarization Summarized information shown could be a few years old and not current.

Upturn AI SummarizationUpturn AI Summarization Fundamental Rating based on AI could be based on old data.

Upturn AI SummarizationUpturn AI Summarization AI-generated summaries may have inaccuracies (hallucinations). Please verify the information before taking action.

About Kulicke and Soffa Industries Inc

Exchange NASDAQ
Headquaters Fort Washington, PA, United States
IPO Launch date 1990-03-26
President, CEO & Director Dr. Fusen Ernie Chen Ph.D.
Sector Technology
Industry Semiconductor Equipment & Materials
Full time employees 2702
Full time employees 2702

Kulicke and Soffa Industries, Inc. engages in the design, manufacture, and sale of capital equipment and tools used to assemble semiconductor devices. It operates through four segments: Ball Bonding Equipment, Wedge Bonding Equipment, Advanced Solutions, and Aftermarket Products and Services (APS). The company offers ball bonding equipment, wafer level bonding equipment, wedge bonding equipment; and advanced display, die-attach, and thermocompression systems and solutions, as well as tools, spares and services for equipment. It also services, maintains, repairs, and upgrades equipment. The company serves integrated device manufacturers, outsourced semiconductor assembly and test providers, other electronics manufacturers, foundry service providers, and automotive electronics suppliers primarily in the United States and the Asia/Pacific region. The company was founded in 1951 and is headquartered in Fort Washington, Pennsylvania.

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