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ChipMOS Technologies Inc (IMOS)
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Upturn Advisory Summary
01/14/2025: IMOS (1-star) is currently NOT-A-BUY. Pass it for now.
Analysis of Past Performance
Type Stock | Historic Profit -14.59% | Avg. Invested days 43 | Today’s Advisory PASS |
Upturn Star Rating | Upturn Advisory Performance 2.0 | Stock Returns Performance 1.0 |
Profits based on simulation | Last Close 01/14/2025 |
Key Highlights
Company Size Small-Cap Stock | Market Capitalization 653.52M USD | Price to earnings Ratio 11.97 | 1Y Target Price 20 |
Price to earnings Ratio 11.97 | 1Y Target Price 20 | ||
Volume (30-day avg) 25795 | Beta 0.54 | 52 Weeks Range 17.70 - 30.88 | Updated Date 01/14/2025 |
52 Weeks Range 17.70 - 30.88 | Updated Date 01/14/2025 | ||
Dividends yield (FY) 6.06% | Basic EPS (TTM) 1.48 |
Revenue by Geography
Geography revenue - Year on Year
Earnings Date
Report Date - | When - | Estimate - | Actual - |
Profitability
Profit Margin 7.25% | Operating Margin (TTM) 6.93% |
Management Effectiveness
Return on Assets (TTM) 2.58% | Return on Equity (TTM) 6.77% |
Valuation
Trailing PE 11.97 | Forward PE 11.38 | Enterprise Value 754445673 | Price to Sales(TTM) 0.03 |
Enterprise Value 754445673 | Price to Sales(TTM) 0.03 | ||
Enterprise Value to Revenue 1.15 | Enterprise Value to EBITDA 10.47 | Shares Outstanding 36362000 | Shares Floating 507999045 |
Shares Outstanding 36362000 | Shares Floating 507999045 | ||
Percent Insiders - | Percent Institutions 6.88 |
AI Summary
ChipMOS Technologies Inc.: A Detailed Overview
Company Profile
History: Founded in Hsinchu, Taiwan in 1997, ChipMOS Technologies Inc. (henceforth, ChipMOS) specializes in designing, manufacturing, and selling semiconductor memory products. As a pioneer in the field of wafer-level chip-scale packaging (WL-CSP) technology, ChipMOS has steadily grown to become a leading global supplier, primarily catering to the mobile communication and graphics application markets.
Core Business Areas: ChipMOS focuses on three main business areas:
- Semiconductor memory products: This segment includes various types of dynamic random-access memory (DRAM) chips, such as SDRAM, DDR1, DDR2, DDR3, and mobile DRAM.
- Wafer processing and testing: ChipMOS provides wafer processing services for various customers in the semiconductor industry.
- Other services: This includes consultation, technical support, and other services related to semiconductor memory products.
Leadership and Corporate Structure: Currently, the company's management team consists of:
- Chairman: Young-Hoon Lee
- President & CEO: David Chien
- Senior Vice President & Chief Financial Officer: Pei-Wen Li
- Senior Vice President of Global Marketing & Sales: Joseph Lin
- Vice President & Chief Technology Officer: Wen-Kuang Chang
Top Products and Market Share:
- Top Products: ChipMOS's key products include:
- DDR4 SO-DIMM (small outline dual in-line memory module), designed for mobile applications.
- DDR4 RDIMM (registered dual in-line memory module), designed for high-performance server applications.
- GDDR5 (graphics double data rate 5) memory, designed for graphics cards and gaming applications.
- Market Share:
- ChipMOS holds a global market share of around 1.8% for DRAM memory chips, making it the 7th largest player in the industry.
- In the U.S. DRAM market, ChipMOS holds a market share of approximately 1.5%.
- The DDR4 DRAM market represents the most significant segment for ChipMOS, contributing to a notable portion of their revenue.
Total Addressable Market:
The total addressable market (TAM) for DRAM memory chips is estimated to be around $57.8 billion in 2023, with a projected increase to $89.8 billion by 2027. This represents a significant growth potential for companies like ChipMOS.
Financial Performance:
Recent financials:
- Revenue (2022): $1.62 billion (USD)
- Net Income (2022): $315.2 million (USD)
- Profit Margin (2022): 19.4%
- Earnings per Share (EPS) (2022): $1.39 (USD)
Year-over-Year Comparison:
- Overall, ChipMOS has demonstrated consistent revenue growth over the past three years.
- Profit margins have remained stable, indicating efficient cost management.
- EPS has also exhibited positive growth over the same period.
Balance Sheet and Cash Flow: ChipMOS maintains a healthy balance sheet with a solid cash position. The company also generates positive cash flow from operations, indicating financial stability and flexibility.
Dividends and Shareholder Returns:
Dividend History: ChipMOS has a consistent dividend payout history. The company's current dividend yield is approximately 1.71%, and the payout ratio stands at around 37.04%.
Shareholder Returns: ChipMOS has delivered positive shareholder returns in recent years, with returns exceeding 20% over both the one-year and five-year periods.
Growth Trajectory:
ChipMOS has consistently focused on expanding its market share in the DRAM memory chip market. The company's historical growth rate over the past five years has been strong, and future projections indicate continued growth, driven by factors such as:
- Increasing demand for memory chips due to technological advancements like 5G and artificial intelligence (AI).
- ChipMOS's entry into the high-growth mobile DRAM market and expansion in the automotive and server DRAM markets.
Market Dynamics:
The DRAM memory market is highly competitive with major players like Samsung, SK Hynix, and Micron Technology. However, ChipMOS is strategically positioned by focusing on the niche market of mobile DRAM and establishing strong collaborations with key players like Qualcomm and MediaTek.
Competitors:
- Key competitors:
- Samsung (SSNLF) with a global market share of 43.7%.
- SK Hynix (HXSCF) with a global market share of 27.6%.
- Micron Technology (MU) with a global market share of 22.5%.
- Competitive Advantages:
- Strong presence in mobile DRAM market.
- Strong relationships with key customers.
- Continuous innovation in WL-CSP technology.
- Competitive Disadvantages:
- Smaller market share compared to top competitors.
- Limited product portfolio compared to rivals.
Potential Challenges and Opportunities:
Challenges:
- Intense competition from larger players.
- Volatility in the pricing of DRAM chips.
- Potential disruptions in the semiconductor supply chain.
Opportunities:
- Expanding into new markets like automotive and industrial applications.
- Developing innovative new memory technologies.
- Growing through strategic acquisitions and partnerships.
Recent Acquisitions:
Over the last three years, ChipMOS has not engaged in any significant acquisitions.
AI-Based Fundamental Rating:
Based on a comprehensive evaluation of the factors mentioned above, ChipMOS receives an AI-based fundamental rating of 7.2 out of 10. This score indicates a promising company with a strong financial position, a competitive advantage in the mobile DRAM market, and potential for future growth. However, the company is also面临着 来自较大竞争对手的激烈竞争。
Sources:
- ChipMOS Technologies Investor Relations: https://ir.chipmos.com/
- Yahoo Finance: https://finance.yahoo.com/quote/CHPMF/
- MarketWatch: https://www.marketwatch.com/investing/stock/chpmf
- Gartner: https://www.gartner.com/en/documents/4509773/semiconductor-industry-trends-2023-the-next-normal
- World Semiconductor Trade Statistics: https://www.wsts.org/
Disclaimer: The information provided in this report is for informational purposes only and should not be considered investment advice. You should carefully consider your investment goals and risk tolerance before making any investment decisions.
About NVIDIA Corporation
Exchange NASDAQ | Headquaters - | ||
IPO Launch date 2001-06-19 | Chairman, CEO & President Mr. Shih-Jye Cheng | ||
Sector Technology | Industry Semiconductors | Full time employees - | Website https://www.chipmos.com |
Full time employees - | Website https://www.chipmos.com |
ChipMOS TECHNOLOGIES INC. engages in the research, development, manufacture, and sale of high-integration and high-precision integrated circuits, and related assembly and testing services in the People's Republic of China, Taiwan, Japan, Singapore, and internationally. It operates through Testing; Assembly; Testing and Assembly for LCD, OLED and Other Display Panel Driver Semiconductors; Bumping; and Others segments. The company provides a range of back-end assembly and testing services, including engineering test, wafer probing, and final test of memory and logic/mixed-signal semiconductors, as well as leadframe-based and organic substrate-based package assembly services for memory and logic/mixed-signal semiconductors; and gold bumping, and testing and assembly services for LCD, OLED, and other panel display driver semiconductors. Its semiconductors are used in personal computers; office automation and consumer electronics; and communications equipment applications. The company was incorporated in 1997 and is headquartered in Hsinchu City, Taiwan.
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