Home 
Today's Top Picks 
Top Performers 
Watchlist 
My Robo Portfolios 
ETF Zone 
Help & Tutorial 
Cancel anytime
- Chart
- Upturn Summary
- Highlights
- Valuation
- Analyst Ratings
Upturn AI SWOT - About
ChipMOS Technologies Inc (IMOS)
- BUY Advisory
- SELL Advisory (Profit)
- SELL Advisory (Loss)
- Profit
- Loss
- Pass (Skip investing)
Stock price based on last close (see disclosures)
- ALL
- YEAR
- MONTH
- WEEK
Upturn Advisory Summary
04/01/2025: IMOS (1-star) is currently NOT-A-BUY. Pass it for now.
Upturn Star Rating
Not Recommended Performance
These Stocks/ETFs, based on Upturn Advisory, consistently fall short of market performance, signaling caution before investing.
AI Based Fundamental Rating
Below Average Performance
These Stocks/ETFs, based on Upturn Advisory, often underperform the market, warranting careful consideration before investing.
Analysis of Past Performance
Type Stock | Historic Profit -25.41% | Avg. Invested days 39 | Today’s Advisory PASS |
Upturn Star Rating | Upturn Advisory Performance  2.0 | Stock Returns Performance  1.0 |
| Profits based on simulation | Last Close 04/01/2025 |
Key Highlights
Company Size Small-Cap Stock | Market Capitalization 649.25M USD | Price to earnings Ratio 15.17 | 1Y Target Price 20 |
Price to earnings Ratio 15.17 | 1Y Target Price 20 | ||
Volume (30-day avg) 24500 | Beta 0.55 | 52 Weeks Range 16.41 - 30.18 | Updated Date 04/1/2025 |
52 Weeks Range 16.41 - 30.18 | Updated Date 04/1/2025 | ||
Dividends yield (FY) 6.23% | Basic EPS (TTM) 1.11 |
Analyzing Revenue: Products, Geography and Growth
Revenue by Geography
Geography revenue - Year on Year
Earnings Date
Report Date - | When - | Estimate - | Actual - |
Profitability
Profit Margin 6.26% | Operating Margin (TTM) 2.16% |
Management Effectiveness
Return on Assets (TTM) 1.74% | Return on Equity (TTM) 5.69% |
Valuation
Trailing PE 15.17 | Forward PE 11.38 | Enterprise Value 734420743 | Price to Sales(TTM) 0.03 |
Enterprise Value 734420743 | Price to Sales(TTM) 0.03 | ||
Enterprise Value to Revenue 1.07 | Enterprise Value to EBITDA 19.11 | Shares Outstanding 35862000 | Shares Floating 585290126 |
Shares Outstanding 35862000 | Shares Floating 585290126 | ||
Percent Insiders - | Percent Institutions 6.46 |
Analyst Ratings
Rating - | Target Price 20 | Buy - | Strong Buy - |
Buy - | Strong Buy - | ||
Hold - | Sell - | Strong Sell - | |
Strong Sell - |
Upturn AI SWOT
ChipMOS Technologies Inc
Company Overview
History and Background
ChipMOS Technologies Inc. was founded in 1997. It has evolved from a memory testing and packaging house to a diverse provider of outsourced semiconductor assembly and test services.
Core Business Areas
- Testing Services: Provides testing services for memory and mixed-signal semiconductors.
- Packaging Services: Offers packaging solutions for various semiconductor devices.
- Assembly Services: Offers assembly services for various semiconductor devices.
Leadership and Structure
The leadership team consists of experienced executives in the semiconductor industry. The organizational structure is hierarchical, with different departments responsible for specific functions.
Top Products and Market Share
Key Offerings
- Memory Testing: Provides testing services for DRAM, NAND Flash, and other memory devices. Market share data is not readily available. Competitors include ASE, Amkor, and Powertech Technology.
- LCD Driver Packaging: Offers packaging solutions for LCD driver ICs used in displays. Market share data is not readily available. Competitors include ASE, Amkor, and PTI.
- Mixed-Signal Testing: Provides testing services for mixed-signal ICs. Market share data is not readily available. Competitors include ASE, Amkor, and Teradyne (equipment supplier).
Market Dynamics
Industry Overview
The semiconductor industry is cyclical and highly competitive, driven by technological innovation and demand for electronic devices.
Positioning
ChipMOS is a mid-sized player in the outsourced semiconductor assembly and test (OSAT) market. Its competitive advantage lies in its expertise in memory testing and packaging, and its customer relationships. Focus on driver ICs provides an entry point to display manufacturers.
Total Addressable Market (TAM)
The OSAT market is estimated to be in the tens of billions of USD. ChipMOS is positioned to capture a portion of this TAM by focusing on its niche areas.
Upturn SWOT Analysis
Strengths
- Strong expertise in memory testing and packaging
- Established customer relationships
- Diverse service offerings
- Strategic location in Asia
Weaknesses
- Smaller scale compared to larger OSAT players
- Dependence on the cyclical semiconductor industry
- Limited pricing power
- Exposure to currency fluctuations
Opportunities
- Growing demand for advanced packaging technologies
- Expansion into new markets and applications
- Strategic partnerships and acquisitions
- Increasing outsourcing by semiconductor companies
Threats
- Intense competition from larger OSAT players
- Technological disruptions
- Economic downturns
- Geopolitical risks
Competitors and Market Share
Key Competitors
- ASE (ASX)
- Amkor (AMKR)
- Powertech Technology (PTI)
Competitive Landscape
ChipMOS competes with larger OSAT players by focusing on its niche areas of expertise and customer service. Larger companies have economies of scale, but ChipMOS attempts to be more nimble in specific technology and customer-centric areas.
Major Acquisitions
Growth Trajectory and Initiatives
Historical Growth: Requires historical financial data to assess growth trends.
Future Projections: Requires analyst estimates for future projections.
Recent Initiatives: Requires information on recent company announcements and strategic decisions.
Summary
ChipMOS is a mid-sized OSAT company specializing in memory and mixed-signal testing and packaging. Its strengths lie in its expertise and customer relationships, but it faces competition from larger players. The company needs to capitalize on growth opportunities in advanced packaging and new markets while mitigating threats from economic downturns and technological disruptions. Specifics of performance are unknown but the market share is small compared to larger entities.
Similar Companies
- ASX
- AMKR
- MTSI
Sources and Disclaimers
Data Sources:
- Company website
- Industry reports
- Analyst reports (limited access)
- SEC filings (where available)
Disclaimers:
The information provided is for informational purposes only and should not be considered financial advice. Market share data may not be precise and are based on estimates. Financial performance data is not provided due to the requirement for real-time access to financial databases.
AI Summarization is directionally correct and might not be accurate.
Summarized information shown could be a few years old and not current.
Fundamental Rating based on AI could be based on old data.
AI-generated summaries may have inaccuracies (hallucinations). Please verify the information before taking action.
About ChipMOS Technologies Inc
Exchange NASDAQ | Headquaters - | ||
IPO Launch date 2001-06-19 | Chairman, CEO & President Mr. Shih-Jye Cheng | ||
Sector Technology | Industry Semiconductors | Full time employees - | Website https://www.chipmos.com |
Full time employees - | Website https://www.chipmos.com | ||
ChipMOS TECHNOLOGIES INC. research, develops, manufactures, and sells high-integration and high-precision integrated circuits, and related assembly and testing services in Taiwan, Japan, People's Republic of China, Singapore, and internationally. The company operates through five segments: Testing, Assembly, LCDD, Bumping and others. It offers a range of back-end testing services for high density memory, mixed-signal and display driver semiconductors; and packaging solutions, such as small outline package, thin small outline package, quad flat package, and substrate-based packages. The company also provides testing solutions for the entire spectrum of integrated circuits, including simple digital logic, complex ASIC, high speed digital, memory, mixed signal and Display driver IC (DDIC) devices. In addition, it offers bumping services, including gold bumping, metal composite bumping, ball drop, copper re-distribution layer, and copper pillar technology. Further, the company provides wafer-level chip scale packaging technology for IC chips still in the form of wafer; and turnkey solutions, including wafer bumping/RDL, wafer sort, assembly, final test, and drop shipment. Its semiconductors are used in personal computers, communications equipment, office automation and consumer electronics. The company was incorporated in 1997 and is headquartered in Hsinchu City, Taiwan.
Upturn is now on iOS and Android!
Experience Upturn on your mobile. Install it now!
Note: This website is maintained by Upturn Corporation, which is an investment adviser registered with the U.S. Securities and Exchange Commission. Such registration does not imply a certain level of skill or training. Investing in securities has risks. Past performance is no guarantee of future returns. No assurance is provided as to any particular investment return, and you may lose money using our services. You are strongly advised to consult appropriate counsel before making any investments in companies you learn about through our services. You should obtain appropriate legal, tax, investment, accounting, and other advice that takes into account your investment portfolio and overall financial situation. You are solely responsible for conducting due diligence on a potential investment. We do not affect trades for you. You will select your own broker through which to transact. Investments are not FDIC insured, they are not guaranteed, and they may lose value. Please see the Privacy Policy, Terms of Use, and Disclosure for more information.