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AMKR
Upturn stock ratingUpturn stock rating

Amkor Technology Inc (AMKR)

Upturn stock ratingUpturn stock rating
$26.98
Delayed price
upturn advisory
PASS
  • BUY Advisory
  • SELL Advisory (Profit)​
  • SELL Advisory (Loss)​
  • Profit
  • Loss
  • Pass (Skip investing)
Upturn Stock infoUpturn Stock info Stock price based on last close
*as per simulation
(see disclosures)
Time period over
  • ALL
  • YEAR
  • MONTH
  • WEEK

Upturn Advisory Summary

12/16/2024: AMKR (1-star) is currently NOT-A-BUY. Pass it for now.

Upturn Star Rating

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Not Recommended Performance

These Stocks/ETFs, based on Upturn Advisory, consistently fall short of market performance, signaling caution before investing.

AI Based Fundamental Rating

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Moderate Performance

These Stocks/ETFs, based on Upturn Advisory, typically align with the market average, offering steady but unremarkable returns.

Analysis of Past Performance

Type Stock
Historic Profit -11.66%
Avg. Invested days 27
Today’s Advisory PASS
Upturn Star Rating Upturn stock ratingUpturn stock rating
Upturn Advisory Performance Upturn Advisory Performance 3.0
Stock Returns Performance Upturn Returns Performance 1.0
Upturn Profits based on simulationUpturn Profits based on simulation Profits based on simulation
Upturn Profits based on simulationUpturn Profits based on simulation Last Close 12/16/2024

Key Highlights

Company Size Mid-Cap Stock
Market Capitalization 4.47B USD
Price to earnings Ratio 12.66
1Y Target Price 29.71
Price to earnings Ratio 12.66
1Y Target Price 29.71
Volume (30-day avg) 1156508
Beta 1.89
52 Weeks Range 17.61 - 43.74
Updated Date 04/1/2025
52 Weeks Range 17.61 - 43.74
Updated Date 04/1/2025
Dividends yield (FY) 1.83%
Basic EPS (TTM) 1.43

Analyzing Revenue: Products, Geography and Growth

Revenue by Products

Product revenue - Year on Year

Revenue by Geography

Geography revenue - Year on Year

Earnings Date

Report Date -
When -
Estimate -
Actual -

Profitability

Profit Margin 5.6%
Operating Margin (TTM) 8.26%

Management Effectiveness

Return on Assets (TTM) 4%
Return on Equity (TTM) 8.7%

Valuation

Trailing PE 12.66
Forward PE 12.76
Enterprise Value 4277985024
Price to Sales(TTM) 0.71
Enterprise Value 4277985024
Price to Sales(TTM) 0.71
Enterprise Value to Revenue 0.66
Enterprise Value to EBITDA 3.82
Shares Outstanding 246732000
Shares Floating 103291756
Shares Outstanding 246732000
Shares Floating 103291756
Percent Insiders 55.76
Percent Institutions 45.38

Analyst Ratings

Rating 3.9
Target Price 33.93
Buy 3
Strong Buy 3
Buy 3
Strong Buy 3
Hold 4
Sell -
Strong Sell -
Strong Sell -

ai summary icon Upturn AI SWOT

Amkor Technology Inc

stock logo

Company Overview

overview logo History and Background

Amkor Technology, Inc. was founded in 1968. It has grown to become one of the world's largest providers of outsourced semiconductor packaging and test services. Significant milestones include expanding its global manufacturing footprint and developing advanced packaging technologies.

business area logo Core Business Areas

  • Advanced Products: Provides advanced packaging solutions for high-performance applications, including flip chip, wafer-level packaging (WLP), and 2.5D/3D packaging.
  • Mainstream Products: Offers a broad range of mainstream packaging solutions for consumer electronics, communications, and automotive applications, including leadframe and laminate-based packages.
  • Test Services: Provides comprehensive test services for semiconductors, including wafer probe, final test, and system-level test.

leadership logo Leadership and Structure

The leadership team includes Giel Rutten (President and CEO). The organizational structure is based on product lines and geographic regions.

Top Products and Market Share

overview logo Key Offerings

  • Flip Chip Ball Grid Array (FCBGA): Provides high-density packaging for processors and GPUs. Market share varies by application. Competitors include ASE, TSMC, and Samsung.
  • Quad Flat No-leads (QFN): A cost-effective packaging solution for a wide range of applications. Market share is significant in consumer electronics. Competitors include ASE, JCET Group, and Powertech Technology.
  • Wafer-Level Chip Scale Package (WLCSP): Provides the smallest form factor packaging solution. Used in mobile and wearable devices. Competitors include ASE, TSMC, and STATS ChipPAC.

Market Dynamics

industry overview logo Industry Overview

The semiconductor packaging and test industry is driven by the increasing demand for smaller, faster, and more power-efficient electronic devices. Key trends include advanced packaging, heterogeneous integration, and the growth of AI, IoT, and automotive applications.

Positioning

Amkor Technology is a leading player in the outsourced semiconductor assembly and test (OSAT) market, with a broad portfolio of packaging and test solutions. Its competitive advantages include its global manufacturing footprint, advanced technology capabilities, and strong customer relationships.

Total Addressable Market (TAM)

The OSAT market is expected to reach hundreds of billions USD in the coming years. Amkor Technology is well-positioned to capture a significant share of this market, with a focus on advanced packaging and high-growth applications.

Upturn SWOT Analysis

Strengths

  • Global Manufacturing Footprint
  • Advanced Packaging Technology
  • Strong Customer Relationships
  • Broad Product Portfolio

Weaknesses

  • High Capital Expenditure
  • Exposure to Cyclical Semiconductor Industry
  • Dependence on Key Customers

Opportunities

  • Growth of Advanced Packaging
  • Expansion into New Markets
  • Increasing Outsourcing Trend
  • AI and IoT growth

Threats

  • Intense Competition
  • Technological Changes
  • Economic Downturns
  • Geopolitical Risks

Competitors and Market Share

competitor logo Key Competitors

  • ASE (ASX)
  • JCET Group (600584.SS)
  • STATS ChipPAC

Competitive Landscape

Amkor Technology competes with other OSAT providers based on technology, cost, and service. Amkor's strengths include its broad portfolio and global footprint, while its weaknesses include high capital expenditure and exposure to cyclical demand.

Major Acquisitions

Growth Trajectory and Initiatives

Historical Growth: Historical growth will vary based on the time and source of data. The structure requires data and data sources change rapidly

Future Projections: Future Projections will vary based on the time and source of data. The structure requires data and data sources change rapidly

Recent Initiatives: Recent Initiatives will vary based on the time and source of data. The structure requires data and data sources change rapidly

Summary

Amkor Technology is a leading OSAT provider with a strong position in the advanced packaging market. Its global footprint and technology capabilities are key strengths. However, it faces risks from intense competition and cyclical demand. Recent initiatives will likely drive future growth. Amkor is a solid player in the semiconductor market.

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Sources and Disclaimers

Data Sources:

  • Company Filings
  • Market Research Reports
  • Analyst Estimates

Disclaimers:

The information provided is for informational purposes only and should not be considered investment advice. Market conditions and company performance can change rapidly.

Upturn AI SummarizationUpturn AI Summarization AI Summarization is directionally correct and might not be accurate.

Upturn AI SummarizationUpturn AI Summarization Summarized information shown could be a few years old and not current.

Upturn AI SummarizationUpturn AI Summarization Fundamental Rating based on AI could be based on old data.

Upturn AI SummarizationUpturn AI Summarization AI-generated summaries may have inaccuracies (hallucinations). Please verify the information before taking action.

About Amkor Technology Inc

Exchange NASDAQ
Headquaters Tempe, AZ, United States
IPO Launch date 1998-04-29
President, CEO & Director Mr. Guillaume Marie Jean Rutten
Sector Technology
Industry Semiconductor Equipment & Materials
Full time employees 28300
Full time employees 28300

Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking, storage, computing, automotive, and consumer applications; and memory products for system memory or platform data storage. The company provides wafer-level CSP packages for power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages used in power management, transceivers, radar, and specialty silicon; silicon wafer integrated fan-out technology that replaces a laminate substrate with a thinner structure; leadframe packages for electronic devices and mixed-signal applications; and substrate-based wirebond packages used to connect a die to a substrate. In addition, it offers micro-electro-mechanical systems packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. Further, the company provides wafer, package, and system level test services, as well as burn-in test and test development services. It serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona.

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