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Amkor Technology Inc (AMKR)AMKR
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Upturn Advisory Summary
09/18/2024: AMKR (1-star) is currently NOT-A-BUY. Pass it for now.
Analysis of Past Upturns
Type: Stock | Upturn Star Rating | Today’s Advisory: PASS |
Profit: -11.69% | Upturn Advisory Performance 3 | Avg. Invested days: 27 |
Profits based on simulation | Stock Returns Performance 1 | Last Close 09/18/2024 |
Type: Stock | Today’s Advisory: PASS |
Profit: -11.69% | Avg. Invested days: 27 |
Upturn Star Rating | Stock Returns Performance 1 |
Profits based on simulation Last Close 09/18/2024 | Upturn Advisory Performance 3 |
Key Highlights
Company Size Mid-Cap Stock | Market Capitalization 7.56B USD |
Price to earnings Ratio 20.19 | 1Y Target Price 40.5 |
Dividends yield (FY) 1.04% | Basic EPS (TTM) 1.52 |
Volume (30-day avg) 1289195 | Beta 1.85 |
52 Weeks Range 17.40 - 44.74 | Updated Date 09/17/2024 |
Company Size Mid-Cap Stock | Market Capitalization 7.56B USD | Price to earnings Ratio 20.19 | 1Y Target Price 40.5 |
Dividends yield (FY) 1.04% | Basic EPS (TTM) 1.52 | Volume (30-day avg) 1289195 | Beta 1.85 |
52 Weeks Range 17.40 - 44.74 | Updated Date 09/17/2024 |
Earnings Date
Report Date - | When - |
Estimate - | Actual - |
Report Date - | When - | Estimate - | Actual - |
Profitability
Profit Margin 5.87% | Operating Margin (TTM) 5.58% |
Management Effectiveness
Return on Assets (TTM) 4.44% | Return on Equity (TTM) 9.67% |
Revenue by Products
Revenue by Products - Current and Previous Year
Revenue by Geography
Revenue by Geography - Current and Previous Year
Valuation
Trailing PE 20.19 | Forward PE 11.82 |
Enterprise Value 7166838556 | Price to Sales(TTM) 1.18 |
Enterprise Value to Revenue 1.12 | Enterprise Value to EBITDA 6.29 |
Shares Outstanding 246388992 | Shares Floating 100874190 |
Percent Insiders 55.54 | Percent Institutions 44.04 |
Trailing PE 20.19 | Forward PE 11.82 | Enterprise Value 7166838556 | Price to Sales(TTM) 1.18 |
Enterprise Value to Revenue 1.12 | Enterprise Value to EBITDA 6.29 | Shares Outstanding 246388992 | Shares Floating 100874190 |
Percent Insiders 55.54 | Percent Institutions 44.04 |
Analyst Ratings
Rating 4 | Target Price 36 | Buy 2 |
Strong Buy 3 | Hold 3 | Sell - |
Strong Sell - |
Rating 4 | Target Price 36 | Buy 2 | Strong Buy 3 |
Hold 3 | Sell - | Strong Sell - |
AI Summarization
Amkor Technology Inc.: A Comprehensive Overview
Company Profile:
History and Background: Amkor Technology Inc. (AMKR) is a leading global provider of semiconductor packaging and test services. Founded in 1968 as Amkor Electronics, the company has grown from a small operation in Tempe, Arizona, to a multinational corporation with over 25,000 employees and facilities across Asia, Europe, and the United States.
Core Business Areas: Amkor's core business revolves around providing comprehensive semiconductor packaging and test solutions. This includes wafer bumping, wafer-level packaging, flip chip, and system-in-package (SiP) solutions. The company caters to a diverse range of end markets, including communications, computing, consumer electronics, industrial, and automotive.
Leadership and Corporate Structure: Amkor operates with a Board of Directors and an executive leadership team led by President and CEO Giel Rutten. The company follows a decentralized management structure, with different business units responsible for specific product lines and geographic regions.
Top Products and Market Share: Products: Amkor's top products include:
- Wafer bumping: A critical process in chip packaging that connects the chip to the package substrate using tiny solder balls.
- Wafer-level packaging (WLP): A space-saving packaging technology that allows multiple chips to be placed directly on the package substrate.
- Flip chip: A packaging technology that allows direct connection between the chip and the substrate, offering improved performance and smaller size.
- System-in-package (SiP): An advanced packaging technology that integrates multiple chips and passive components into a single package, providing miniaturization and enhanced functionality.
Market Share: Amkor holds a significant market share in the semiconductor packaging industry. According to Yole Développement, as of 2022, Amkor was the second largest OSAT (Outsourced Semiconductor Assembly and Test) provider globally, with a 16% market share. In the WLP segment, Amkor holds the leading position with a 23% market share.
Product Performance and Market Reception: Amkor's products are recognized for their high quality, reliability, and performance. The company has received numerous awards and recognitions from industry analysts and customers. However, it faces stiff competition from other major players in the market, such as ASE Technology Holding Co. and JCET Group.
Total Addressable Market: The global semiconductor packaging market is estimated to be worth over $44 billion in 2022 and is projected to grow at a CAGR of around 7% to reach over $64 billion by 2027. The increasing demand for miniaturized, high-performance electronics is driving growth in the market.
Financial Performance:
Revenue and Net Income: Amkor's revenue has been on an upward trend in recent years. In 2022, the company reported a revenue of $5.1 billion, representing a year-over-year increase of 24%. Net income also saw a significant increase, reaching $444 million in 2022, compared to $143 million in 2021.
Profit Margins and EPS: The company's gross profit margin stood at 16.5% in 2022, while the operating margin was 6.5%. Earnings per share (EPS) witnessed a remarkable growth, reaching $2.04 in 2022 compared to $0.65 in 2021.
Cash Flow and Balance Sheet Health: Amkor's cash flow from operations in 2022 was $515 million, demonstrating the company's strong operational efficiency. The balance sheet also appears healthy with a moderate debt-to-equity ratio of 0.83.
Dividends and Shareholder Returns:
Dividend History: Amkor has a history of paying dividends, although the payout ratio has fluctuated in recent years. In 2022, the company's dividend yield was 0.85%.
Shareholder Returns: Over the past year, Amkor's total shareholder return (TSR) was 52%. In the longer term, the TSR has been more volatile, reflecting the cyclical nature of the semiconductor industry.
Growth Trajectory:
Historical Growth: Amkor has experienced significant growth in recent years. Between 2018 and 2022, the company's revenue grew at a CAGR of 15%.
Future Growth Projections: The semiconductor packaging market is expected to maintain steady growth in the coming years, driven by increasing demand for advanced packaging solutions. Amkor is well-positioned to capitalize on this growth,
AI Summarization is directionally correct and might not be accurate.
Summarized information shown could be a few years old and not current.
Fundamental Rating based on AI could be based on old data.
AI-generated summaries may have inaccuracies (hallucinations). Please verify the information before taking action.
About Amkor Technology Inc
Exchange | NASDAQ | Headquaters | Tempe, AZ, United States |
IPO Launch date | 1998-04-29 | President, CEO & Director | Mr. Giel Rutten |
Sector | Technology | Website | https://amkor.com |
Industry | Semiconductor Equipment & Materials | Full time employees | 28700 |
Headquaters | Tempe, AZ, United States | ||
President, CEO & Director | Mr. Giel Rutten | ||
Website | https://amkor.com | ||
Website | https://amkor.com | ||
Full time employees | 28700 |
Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, the Middle East, Africa, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking, storage, computing, automotive, and consumer applications; and memory products for system memory or platform data storage. The company also provides wafer-level CSP packages for power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages used in power management, transceivers, radar, and specialty silicon; silicon wafer integrated fan-out technology that replaces a laminate substrate with a thinner structure; leadframe packages for electronic devices and mixed-signal applications; and substrate-based wirebond packages used to connect a die to a substrate. In addition, it offers micro-electro-mechanical systems packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. Further, the company provides wafer, package, and system level test services, as well as burn-in test and test development services. It serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. The company was founded in 1968 and is headquartered in Tempe, Arizona.
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