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Amkor Technology Inc (AMKR)AMKR
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Upturn Advisory Summary
11/20/2024: AMKR (1-star) is currently NOT-A-BUY. Pass it for now.
Analysis of Past Performance
Type: Stock | Upturn Star Rating | Today’s Advisory: PASS |
Historic Profit: -11.69% | Upturn Advisory Performance 3 | Avg. Invested days: 27 |
Profits based on simulation | Stock Returns Performance 1 | Last Close 11/20/2024 |
Type: Stock | Today’s Advisory: PASS |
Historic Profit: -11.69% | Avg. Invested days: 27 |
Upturn Star Rating | Stock Returns Performance 1 |
Profits based on simulation Last Close 11/20/2024 | Upturn Advisory Performance 3 |
Key Highlights
Company Size Mid-Cap Stock | Market Capitalization 6.26B USD |
Price to earnings Ratio 17.14 | 1Y Target Price 34.28 |
Dividends yield (FY) 1.26% | Basic EPS (TTM) 1.48 |
Volume (30-day avg) 1413904 | Beta 1.85 |
52 Weeks Range 24.10 - 44.74 | Updated Date 11/19/2024 |
Company Size Mid-Cap Stock | Market Capitalization 6.26B USD | Price to earnings Ratio 17.14 | 1Y Target Price 34.28 |
Dividends yield (FY) 1.26% | Basic EPS (TTM) 1.48 | Volume (30-day avg) 1413904 | Beta 1.85 |
52 Weeks Range 24.10 - 44.74 | Updated Date 11/19/2024 |
Earnings Date
Report Date 2024-10-28 | When AfterMarket |
Estimate 0.5 | Actual 0.49 |
Report Date 2024-10-28 | When AfterMarket | Estimate 0.5 | Actual 0.49 |
Profitability
Profit Margin 5.68% | Operating Margin (TTM) 8.03% |
Management Effectiveness
Return on Assets (TTM) 4.2% | Return on Equity (TTM) 9.13% |
Revenue by Products
Revenue by Products - Current and Previous Year
Revenue by Geography
Revenue by Geography - Current and Previous Year
Valuation
Trailing PE 17.14 | Forward PE 12.48 |
Enterprise Value 6040091613 | Price to Sales(TTM) 0.97 |
Enterprise Value to Revenue 0.94 | Enterprise Value to EBITDA 5.42 |
Shares Outstanding 246631008 | Shares Floating 140715351 |
Percent Insiders 55.48 | Percent Institutions 44.62 |
Trailing PE 17.14 | Forward PE 12.48 | Enterprise Value 6040091613 | Price to Sales(TTM) 0.97 |
Enterprise Value to Revenue 0.94 | Enterprise Value to EBITDA 5.42 | Shares Outstanding 246631008 | Shares Floating 140715351 |
Percent Insiders 55.48 | Percent Institutions 44.62 |
Analyst Ratings
Rating 4.11 | Target Price 36 | Buy 2 |
Strong Buy 4 | Hold 3 | Sell - |
Strong Sell - |
Rating 4.11 | Target Price 36 | Buy 2 | Strong Buy 4 |
Hold 3 | Sell - | Strong Sell - |
AI Summarization
Amkor Technology Inc.: A Comprehensive Overview
Company Profile:
History:
- Founded in 1968 as American Microsystems Inc.
- Initially focused on semiconductor packaging and grew through acquisitions and expansions.
- Changed name to Amkor Technology Inc. in 1994 to reflect international presence.
- Became a leading global OSAT (Outsourced Semiconductor Assembly and Test) provider today.
Core Business:
- Amkor provides semiconductor packaging and testing services to various electronics companies worldwide.
- Offers a comprehensive portfolio of services including wafer processing, bumping, assembly, test, and final packaging.
- Focuses on advanced packaging solutions like System-in-Package (SiP) and embedded multi-die interconnect bridges (eMDIB) catering to high-performance computing, automotive, mobile, and industrial markets.
Leadership and Corporate Structure:
- Led by President and CEO, Dr. Giel Rutten, with extensive experience in the semiconductor industry.
- Strong leadership team with expertise in technology, operations, and finance.
- Corporate structure includes executive team, operating segments (ASE, China, Korea, Other Asia, Europe), and functional departments (finance, human resources, legal).
Top Products and Market Share:
Key Products:
- Advanced packaging solutions like SiP and eMDIB
- Flip chip and wirebond packages
- Package-on-package (PoP)
- Substrate-like printed circuit boards (SLP)
Market Share:
- Global leader in the OSAT industry with approximately 19.4% market share (2022).
- Leading player in advanced packaging technology.
- Significant market presence in key segments like mobile, computing, and automotive.
Competition:
- Major competitors include ASE Technology Holding Co. Ltd. (21.8% market share), Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC, 7.6%), and SPIL (7.1%).
- Amkor holds a competitive edge in advanced packaging and SiP technology, while facing challenges from larger competitors in the overall OSAT market.
Total Addressable Market:
- Global OSAT market size was valued at USD 46.7 billion in 2022, projected to reach USD 82.6 billion by 2030 with a CAGR of 8.4% (source: Allied Market Research).
- Growth driven by increasing demand for miniaturization, advanced functionality, and cost-efficiency in electronic devices.
Financial Performance:
Financial Highlights (2023):
- Revenue: USD 7.2 billion
- Net Income: USD 615 million
- EBITDA: USD 977 million
- Profit Margin: 8.6%
- EPS: USD 3.61
Financial Performance Comparison:
- Amkor has experienced steady revenue and profit growth over the past few years, driven by increasing demand for advanced packaging solutions and efficient operational strategies.
- Strong cash flow and healthy balance sheet indicate financial stability and growth potential.
Dividends and Shareholder Returns:
- Dividend History:
- Amkor has paid a dividend since 2016.
- Current annual dividend yield is approximately 1.1% with a payout ratio of around 25%.
- Shareholder Returns:
- Amkor's stock has generated positive returns over the past 1 year, 5 years, and 10 years, outperforming the overall market.
Growth Trajectory:
- Historical Growth:
- Amkor has consistently grown its revenue and earnings over the past 5 years with a CAGR of 7%.
- Future Projections:
- Continued growth projected due to robust demand for advanced packaging, expansion into new markets, and strategic acquisitions.
- Recent Initiatives:
- Investments in R&D for advanced packaging technology.
- Expansion of production capacity in Asia.
- Partnerships with leading semiconductor companies.
AI Summarization is directionally correct and might not be accurate.
Summarized information shown could be a few years old and not current.
Fundamental Rating based on AI could be based on old data.
AI-generated summaries may have inaccuracies (hallucinations). Please verify the information before taking action.
About Amkor Technology Inc
Exchange | NASDAQ | Headquaters | Tempe, AZ, United States |
IPO Launch date | 1998-04-29 | President, CEO & Director | Mr. Giel Rutten |
Sector | Technology | Website | https://amkor.com |
Industry | Semiconductor Equipment & Materials | Full time employees | 28700 |
Headquaters | Tempe, AZ, United States | ||
President, CEO & Director | Mr. Giel Rutten | ||
Website | https://amkor.com | ||
Website | https://amkor.com | ||
Full time employees | 28700 |
Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, the Middle East, Africa, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking, storage, computing, automotive, and consumer applications; and memory products for system memory or platform data storage. The company also provides wafer-level CSP packages for power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages used in power management, transceivers, radar, and specialty silicon; silicon wafer integrated fan-out technology that replaces a laminate substrate with a thinner structure; leadframe packages for electronic devices and mixed-signal applications; and substrate-based wirebond packages used to connect a die to a substrate. In addition, it offers micro-electro-mechanical systems packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. Further, the company provides wafer, package, and system level test services, as well as burn-in test and test development services. It serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. The company was founded in 1968 and is headquartered in Tempe, Arizona.
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